Stand: 21.6.2021, 15:37
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Stand: 21.6.2021, 15:37
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Vol |
Jahr |
No. |
Seiten |
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|---|---|---|---|---|---|---|---|---|---|---|
| F. Kraemer | C. Pauly, F. Mücklich, S. Wiese | „Simulation of a flip chip onding technique using reactive foils“ | Proceedings, Thermal, Mechanical and Multi-Physics Simulationand Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on | 2015 | published |
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